Process Precision
1. Core Capabilities Overview
Layer Count
1-40 Layers
Max Panel Size
730 x 630 mm
Finished Board Thickness
0.3 – 4.0 mm
Mechanical Drill Range
0.1 – 6.5 mm
Laser Drill Range
70 – 150 μm
Max Copper Thickness
5OZ
Min Core Thickness
0.05 mm
Min Trace Width (22±3μm Cu)
0.05 mm / 2 mil
Min Trace Spacing (22±3μm Cu)
0.05 mm / 2 mil
Min Annular Ring
3 mil
Min Profile Tolerance
±0.075 mm
2. Drilling Process Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Max Production Size | 630 x 730 mm | 630 x 730 mm |
| Hole Position Accuracy Tolerance | ±0.05 mm | ±0.025 mm |
| Mechanical Drill Size | Ø0.15 mm ~ Ø6.5 mm | Ø0.1 mm ~ Ø6.5 mm |
| Laser Drill Size | Ø70 μm ~ Ø150 μm | Ø70 μm ~ Ø150 μm |
| Min Slot Hole Size | Ø0.50 mm | Ø0.45 mm |
| PTH Hole Size Tolerance | ±0.075 mm | ±0.05 mm |
| NPTH Hole Size Tolerance | ±0.05 mm | ±0.05 mm |
Equipment: Han’s Laser Drilling Machine / Han’s Mechanical Drilling Machine
3. Copper Deposition & Plating Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Plating Production Size Range | ≤730 mm | ≤735 mm |
| Plating Product Thickness Range | 0.075 mm ~ 1.8 mm | 0.05 mm ~ 2.4 mm |
| Hole Copper Thickness Range | 13 μm ~ 25 μm | 13 μm ~ 40 μm |
| Surface Copper Uniformity | R≤0.004 mm | R≤0.002 mm |
| Hole Copper Uniformity | ±0.005 mm | ±0.003 mm |
| Through-Hole Aspect Ratio | 8:1 | 10:1 |
| Blind Via Aspect Ratio | 0.8:1 | 1:1 |
Equipment: Dongwei VCP Line / Jingming Plating Line
4. Circuit (LDI Exposure) Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Board Thickness Range | 0.5 ~ 5.0 mm | 0.4 ~ 5.0 mm |
| Exposure Registration Accuracy | ±0.012 mm | ±0.008 mm |
| Min Annular Ring | Single side ≥0.075 mm | Single side ≥0.05 mm |
| 1/3 OZ Base Copper Min L/S | 0.045 mm / 0.045 mm | 0.04 mm / 0.04 mm |
| 1/2 OZ Base Copper Min L/S | 0.05 mm / 0.05 mm | 0.05 mm / 0.05 mm |
| 1 OZ Base Copper Min L/S | 0.075 mm / 0.075 mm | 0.075 mm / 0.075 mm |
| 1/3 OZ Base Copper Etch Tolerance | ±0.005 mm | ±0.005 mm |
| 1/2 OZ Base Copper Etch Tolerance | ±0.005 mm | ±0.005 mm |
| 1 OZ Base Copper Etch Tolerance | ±0.0075 mm | ±0.0075 mm |
| Gold Finger Total Pitch Tolerance | ≤30 mm: ±0.05 mm 30~60 mm: ±0.075 mm | ≤30 mm: ±0.03 mm 30~60 mm: ±0.05 mm |
Equipment: Han’s LDI Exposure Machine / Yuanzhuo LDI Exposure Machine
5. Solder Mask Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Printing Misregistration Tolerance | ±0.125 mm | ±0.1 mm |
| Exposure Misregistration Tolerance | ±0.025 mm | ±0.012 mm |
| Min Solder Mask Dam | ≥0.05 mm | ≥0.045 mm |
| Ink Thickness Range | 0.01 mm ~ 0.055 mm | 0.01 mm ~ 0.055 mm |
| Ink Thickness Tolerance | ±0.010 mm | ±0.005 mm |
Equipment: Han’s Solder Mask LDI Exposure Machine / 3-Module Inline Printer
6. Legend (Silkscreen) Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Misregistration Tolerance | ±0.075 mm | ±0.05 mm |
| Min Legend Height | ≥0.8 mm | ≥0.7 mm |
| Min Legend Line Width | ≥0.125 mm | ≥0.1 mm |
| Min Distance: Legend to Profile | ≥0.3 mm | ≥0.2 mm |
| Min Distance: Legend to Circuit | ≥0.4 mm | ≥0.3 mm |
| Min Distance: Legend to Solder Pad | ≥0.15 mm | ≥0.125 mm |
Equipment: Automatic Inkjet Legend Printer / Inline Legend Printing Machine
7. Profiling Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Profile Tolerance | ±0.1 mm | ±0.075 mm |
| Min Distance: Circuit to Board Edge | ≥0.15 mm | ≥0.125 mm |
| Profile Edge to Solder Mask Opening | ±0.15 mm | ±0.10 mm |
| Min Half-Hole Diameter | ≥0.45 mm | ≥0.4 mm |
| Controlled Depth Accuracy | ≥0.1 mm | ≥0.08 mm |
| Min Spacing Between Units | ≥1 mm | ≥1 mm |
Equipment: Daliang 6-Axis Router / Jin Dali 6-Axis Router
8. Surface Finish Parameters
| Item | Mass Production Capability | Advanced Capability |
|---|---|---|
| Nickel Thickness (Electrolytic Ni/Au) | 1 μm ~ 20 μm | 1 μm ~ 20 μm |
| Gold Thickness (Electrolytic Ni/Au) | 0.05 μm ~ 0.76 μm | 0.05 μm ~ 0.76 μm |
| Nickel Thickness (Electroless Ni/Au – ENIG) | 1 μm ~ 10 μm | 1 μm ~ 10 μm |
| Gold Thickness (Electroless Ni/Au – ENIG) | 0.025 μm ~ 0.075 μm | 0.025 μm ~ 0.075 μm |
| OSP Film Thickness | 0.2 μm ~ 0.5 μm | 0.2 μm ~ 0.5 μm |
| HASL (HALS) | 1 μm ~ 40 μm | 1 μm ~ 40 μm |
Equipment: ENIG Line / OSP Line / HASL Line
9. Lead Time (Days)
| Type | Double-Sided | 4L | 6L | 8L | 10L | 12L | Resin Plug Hole | Gold Finger |
|---|---|---|---|---|---|---|---|---|
| Prototype – Through-Hole | 5 | 6 | 8 | 10 | +4 days | +4 days | — | — |
| Prototype – 1-Step HDI | — | 7 | 9 | 11 | — | — | — | — |
| Prototype – 2-Step HDI | — | — | 9 | 12 | — | — | — | — |
| Mass Production – Through-Hole | 10-12 | 13-15 | 16-20 | 22 | — | — | — | — |
| Mass Production – 1-Step HDI | — | 14-16 | 20 | 22 | — | — | — | — |
| Mass Production – 2-Step HDI | — | — | 22 | 24 | — | — | — | — |
Notes:
1. Orders placed before 14:00 on a business day are counted from that day; orders after 14:00 are counted from the next business day.
2. For multilayer boards, same rule applies.
3. Orders with EQ (engineering questions) are counted from the EQ reply time; orders awaiting laminate are counted from the material arrival date.
10. HDI Technology Roadmap
| Technical Item | 2025 | 2026 | 2027 | |||
|---|---|---|---|---|---|---|
| Mass Prod. | Prototype | Mass Prod. | Prototype | Mass Prod. | Prototype | |
| Max. Structure | 2+n+2 | 3+n+3 | 4+n+4 | 6+n+6 | 6+n+6 | 7+n+7 |
| Stack Via | Any Layer (4-12L) | Any Layer (4-14L) | Any Layer (4-14L) | Any Layer (4-16L) | Any Layer (16L) | Any Layer (16L) |
| Board Thickness – Min. 8L | 0.8 mm | 0.7 mm | 0.7 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Board Thickness – Min. 10L | 0.9 mm | 0.8 mm | 0.8 mm | 0.70 mm | 0.70 mm | 0.70 mm |
| Board Thickness – Min. 12L | 1.0 mm | 0.85 mm | 0.85 mm | 0.85 mm | 0.85 mm | 0.85 mm |
| Board Thickness – MAX. | 3.0 mm | 3.0 mm | 3.0 mm | |||
| Min. Core Thickness | 50 μm | 50 μm | 50 μm | 50 μm | 50 μm | 40 μm |
| Min. PP Thickness | 45 μm (1027) | 40 μm (1027) | 40 μm (1027) | 30 μm (1017) | 30 μm (1017) | 30 μm (1017) |
| Base Copper – Inner Layer | 1/3 OZ ~ 2 OZ | |||||
| Base Copper – Outer Layer | 1/3 OZ ~ 1 OZ | |||||
| Min. Mechanical Drill Hole (μm) | 150 | 150 | 150 | 150 | 150 | 150 |
| Max. Through-Hole Aspect Ratio | 8:1 | 10:1 | 20:1 | 20:1 | 20:1 | 20:1 |
| Min. Laser Via / Pad Size (μm) | 75/200 | 75/180 | 75/180 | 70/160 | 70/160 | 60/150 |
| Max. Laser Via Aspect Ratio | 0.8:1 | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 |
| Via-on-PTH (VOP) Design | Yes | Yes | Yes | Yes | Yes | Yes |
| Min. L/S – Inner Layer (μm) | 45/45 | 40/40 | 45/45 | 40/40 | 40/40 | 35/35 |
| Min. L/S – Outer Layer (μm) | 50/50 | 45/45 | 45/45 | 40/40 | 40/40 | 35/35 |
| Min. BGA Pitch (mm) | 0.4 | 0.35 | 0.35 | 0.3 | 0.3 | 0.3 |
| Solder Mask Registration (μm) | ±25 | ±12 | ±20 | ±12 | ±18 | ±12 |
| Min. Solder Mask Dam (mm) | 0.075 | 0.05 | 0.06 | 0.05 | 0.05 | 0.04 |
| Impedance Control Tolerance – 100Ω | ±10% | ±8% | ±8% | ±7% | ±7% | ±7% |
| Impedance Control Tolerance – 50Ω | ±10% | ±8% | ±8% | ±7% | ±7% | ±7% |
| PCB Warpage Control | ≤0.75% | ≤0.5% | ≤0.5% | ≤0.5% | ≤0.5% | ≤0.5% |
| Surface Finish | OSP / ENIG / Electrolytic Gold / HASL | |||||
11. Standard Laminate Materials
| Tg Grade | Shengyi (SYTECH) | ITEQ | Nanya (NANYA) | EMC | Nouya | Zhiyuan | TUC |
|---|---|---|---|---|---|---|---|
| Standard Tg | — | — | NPG140 | — | NY2140 | ZY-158 | — |
| Mid Tg | S1000H | IT158 | NPG155F | EM285 | NY2150 | ZY-158A | TU-662/TU-747 |
| High Tg | S1000-2 / S1000-2M | IT180A / IT180I | NP175F | EM827 / EM370(5) | NY2170 | ZY-180 | TU-768 |
| High Tg (Halogen Free) | S1150G | IT150G / IT168G | NPG151 | EM355(D) | — | — | — |
All materials are UL certified and RoHS compliant.
12. High-Speed Laminate Materials
Tg measured by DSC/TMA/DMA; Dk and Df measured at specified frequencies.
Middle Loss
| Brand | EMC | Shengyi | ITEQ | TUC | Nanya | Isola |
|---|---|---|---|---|---|---|
| Model | EM-370(D) | S7040G | IT-170GRA1 | TU-862S | NPG-170N / NPG-171 | IS415 |
| Halogen | Free | Free | Free | Free | Free | Free / Halogenated |
| Tg | 175/DSC | 175/DSC | 175/DSC | 175/DSC | 170/DSC | 200/DSC |
| Dk @1GHz | 4.1 | 3.9 | 4.0 | 4.3 | 4.1 | 3.83 |
| Df @1GHz | 0.011 | 0.007 | 0.008 | 0.011 | 0.009 | 0.012 |
Low Loss
| Brand | EMC | Shengyi | ITEQ | TUC | Nanya | Isola |
|---|---|---|---|---|---|---|
| Model | EM-526/528 / EM-888(S) | S7439G / S7439C | IT-170GRA2 / IT-958G | TU-863+ | NPG-170D | I-Speed |
| Halogen | Free | Free | Free / Halogenated | Free | Free | Free / Halogenated |
| Tg | 220/TMA | 210/TMA | 181/DSC | 175/DSC | 175/DSC | 180/DSC |
| Dk @1GHz | 4.0 | 3.8 | 3.93 | 4.0 | 3.85 | 3.65 |
| Df @1GHz | 0.005 | 0.006 | 0.0043 | 0.006 | 0.0054 | 0.0058 |
Ultra Low Loss
| Brand | EMC | Shengyi | ITEQ | TUC | Nanya | Panasonic |
|---|---|---|---|---|---|---|
| Model | EM-890(K) | Synamic 6 / 8G | IT-968 | TU-883A / TU-883 | NPG-186 [M6] / NPG-198 [M7] | TerraGreen R-5775(G) / R-5785(GE&GN) |
| Halogen | Free | Free / Halogenated | Free | Free | Free | Free / Halogenated |
| Tg | 170/TMA | 190/DSC | 175/TMA | 170/TMA | 220/DMA | 200/DSC |
| Dk | 3.0 @10GHz | 3.58 @10GHz | 3.84 @1GHz | 3.64 @10GHz | 3.4 @3GHz | 3.44 @10GHz |
| Df | 0.0025 @10GHz | 0.0036 @10GHz | 0.0031 @1GHz | 0.0036 @10GHz | 0.003 @3GHz | 0.0039 @10GHz |
13. High-Frequency Laminate Materials
| Brand | Rogers | Taconic | Zhongying Wangling | Shengyi (SYTECH) | Guoneng |
|---|---|---|---|---|---|
| Models | RO4350B | RF-35 | ZYF220D | S7136H | GN300H |
| RO4730G3 | TLP-5 | ZYF255D | AeroWave300 | GN220A | |
| RO3003 | TLX-8 / TLX-9 / TLY-5 | ZYF265D / ZYF300CA-P / ZYF300CA-C | Synamic 6 | GNC300M | |
| TLA-6 | F4BM-2 / F4BTME-2 / F4BMXE-2 |
14. Chemical Suppliers
| Category | Supplier |
|---|---|
| Through-Hole Plating Chemicals | Baikal |
| HDI Plating Chemicals | MacDermid |
| OSP Chemicals | Dongfangxing |
15. Product Showcase
| Product Structure | Min L/S (mm) | Min Hole Size (mm) | Surface Finish | Application |
|---|---|---|---|---|
| 6-Layer (Heavy Copper) | 0.30 / 0.30 | 0.50 | ENIG | Automotive ECU |
| 4-Layer | 0.18 / 0.075 | 0.60 | ENIG | EV Charging Station |
| 2-Layer (Thermal Separation) | 0.30 / 0.30 | 2.0 | ENIG | Premium Automotive Lighting |
| 6-Layer Through-Hole | 0.18 / 0.20 | 0.40 | ENIG | Automotive ECU Module |
| 12-Layer | 0.075 / 0.075 | 0.25 | ENIG | Automotive BCM |
| 8-Layer 2-Step HDI | 0.05 / 0.05 | 0.10 | ENIG | Automotive Engine Board |
| 10-Layer 2-Step HDI | 0.051 / 0.059 | 0.10 | ENIG + OSP | Smart Home |
| 8-Layer 2-Step HDI | 0.074 / 0.095 | 0.10 | OSP | Industrial Control |
| 12-Layer 2-Step HDI | 0.045 / 0.076 | 0.10 | ENIG + OSP | Industrial Control |
| 8-Layer 2-Step HDI | 0.064 / 0.075 | 0.10 | ENIG + OSP | 4G Communication Module |
| 10-Layer 3-Step HDI | 0.055 / 0.06 | 0.10 | ENIG + OSP | 5G Communication Module |
| 10-Layer 3-Step HDI | 0.05 / 0.055 | 0.10 | ENIG + OSP | 5G Communication Module |
| 10-Layer 2-Step HDI | 0.047 / 0.051 | 0.10 | ENIG + OSP | Smartphone |
| 12-Layer 3-Step HDI | 0.05 / 0.06 | 0.10 | ENIG + OSP | Smartphone |
| 8-Layer 2-Step HDI | 0.05 / 0.06 | 0.09 | ENIG + OSP | Smartphone |
| 10-Layer 2-Step HDI | 0.046 / 0.05 | 0.09 | OSP | Tablet |
| 12-Layer 2-Step HDI | 0.05 / 0.05 | 0.09 | ENIG | Tablet |
| 12-Layer 3-Step HDI | 0.05 / 0.05 | 0.09 | ENIG | Laptop |
16. Inspection Equipment
| No. | Equipment | Function |
|---|---|---|
| 1 | 3D Blind Via Microscope | 3D inspection of blind via holes |
| 2 | Impedance Tester | Impedance control measurement |
| 3 | High Voltage Withstand Tester | Dielectric withstand voltage test |
| 4 | Insulation Resistance Tester | Insulation resistance measurement |
| 5 | Line Width Tester | Trace width measurement |
| 6 | CMI Copper Thickness Gauge | Copper thickness measurement |
| 7 | Profile Flash Tester | Profile dimension inspection |
| 8 | Zeiss Metallographic Microscope | Cross-section microstructure analysis |
17. Testing Equipment
| No. | Equipment | Function |
|---|---|---|
| 1 | Thermal Shock Chamber | Cold & hot thermal cycling test |
| 2 | Constant Temperature & Humidity Chamber | Environmental reliability test |
| 3 | Peel Strength Tester | Copper peel strength test |
| 4 | HCT Tester | Hollow copper tensile test |
| 5 | 12-Zone IR Reflow Oven | Solder reflow simulation |
| 6 | CAF Tester | Cathodic Anodic Filamentation test |
| 7 | Tg Tester | Glass transition temperature measurement |
| 8 | Salt Spray Tester | Salt spray corrosion resistance test |
| 9 | X-Ray Coating Thickness Gauge | Surface coating thickness measurement |
| 10 | AA Spectrometer (Atomic Absorption) | Metal content analysis |
| 11 | RoHS Tester | RoHS hazardous substance detection |
| 12 | Ionic Contamination Tester | Ionic cleanliness measurement |
SEM (Scanning Electron Microscope): Under evaluation.
18. Internal Laboratory Test Capability
| No. | Equipment | Brand | Model | Accuracy | Capability / Range |
|---|---|---|---|---|---|
| 1 | Line Width & Spacing Tester | Bantone | D300 | ±1 μm | Max board size: 720 x 720 mm |
| 2 | Gold/Nickel Thickness Tester | Qiancheng | SY-QP-050 | ±5% | Lower limit: Au ≥ 0.005 μm, Ni ≥ 0.01 μm Upper limit: Au ≤ 50 μm, Ni ≤ 100 μm |
| 3 | Tin Furnace | Chuangmeicheng | CM280S | 0.1 °C | Temperature range: 0 – 400 °C |
| 4 | Constant T/H Chamber | Junchi | JC-HW-225L | ±5% | Temp: -40 to 150 °C Humidity: 0 – 100% RH |
| 5 | HCT Tester | Bantone | BT-HCT80 | Current ≤ 0.1% + 5mA Voltage ≤ 0.03% + 5mA | Room temp to 300 °C (max) |
| 6 | Insulation Resistance Tester | Tonghui | TH2683A | ±5% | Resistance: 9999 Ω – 100 KΩ Voltage: 0 – 2000 V |
| 7 | Thermal Shock Chamber | Junchi | JC-LR-100L | ±5% | Temperature range: -60 to 160 °C |
| 8 | Metallographic Microscope | Sanhhao | HD-51F / Axiolab5 | 0.0001 μm | Magnification: 50X – 1000X |
| 9 | UV-Vis Spectrophotometer | Youke | 752N | 0.001 A | Spectral range: 160 – 630 nm |
| 10 | Ionic Contamination Tester | Bantone | ICT7563 | ±5% | Testable board size: 150 x 150 mm – 630 x 750 mm |
| 11 | Withstand Voltage Tester | Changchuang | SJ7122 | ±5% | Voltage range: 0 – 3000 V |
| 12 | Low Resistance Tester | Zhangyin | TH2511 | ±0.1% | Resistance range: 0.01 mΩ – 19.9999 kΩ |
| 13 | Peel Strength Tester | Dayu | DY-BL-A1 | ±0.2% F.S. | 0 – 10 N |
| 14 | Salt Spray Tester | Junchi | LX-60 | ±0.1 ml | Spray volume: 80 cm²/h |
| 15 | Reflow Soldering Tester | Risung | SER-712AH | 1 °C | Max board size: 460 mm |
| 16 | Insulation Resistance Test System | Sanhhao | HD-500 | Test voltage 5V: ±5-10% Test voltage 50V: ±15% Test voltage 100V: ±30% | Resistance range: 10⁶ – 10¹⁴ |
| 17 | Gantry-type Fast Measuring Instrument | Sanhhao | HD-7060KS | 0.5 μm | Effective travel: 600 x 700 x 200 mm |
| 18 | Differential Scanning Calorimeter (DSC) | Sanhhao | HD-DSC3000 | ±0.01 °C | Temperature range: -40 to 600 °C |
Test conditions and acceptance criteria reference Huawei Terminal and IPC-related standards. Other conditions or acceptance requirements from customers shall be mutually agreed by both parties.
