Process Precision Parameters (Core Indicators)

Number of layers	Floors 2 to 32
Maximum size for imposition printing	730mm*630mm
Finished board thickness range	0.3mm~4.0mm
Mechanical drilling hole diameter range	0.1mm~6.5mm
Laser drilling hole diameter range	70μm~150μm
Upper limit of copper thickness	5OZ
The thinnest core board thickness	0.05mm
Minimum line width (copper face 22±3)	0.05mm/2mil
Minimum wire spacing (surface copper 22±3)	0.05mm/2mil
Minimum welding ring	3mil
Minimum Dimensional Tolerance	±0.075mm

Drilling process parameters

Project	Mass production process capability	Maximum range capability
Production size limit	630*730mm	630*730mm
Hole position accuracy tolerance	±0.05mm	±0.025mm
Mechanical aperture dimensions	Ø0.15mm~Ø6.5mm	Ø0.1mm~Ø6.5mm
Laser hole diameter dimensions	Ø70μm~Ø150μm	Ø70μm~Ø150μm
Minimum slot hole diameter size	Ø0.50mm	Ø0.45mm
PTH hole diameter tolerance	±0.075mm	±0.05mm
NPTH hole diameter tolerance	±0.05mm	±0.05mm

Electroplating process parameters

Project	Mass production process capability	Maximum range capability
Copper immersion production size range	≤730mm	≤735mm
Thickness range of copper immersion production products	0.075mm~1.8mm	0.05mm~2.4mm
Thickness range for hole copper production	13μm~25μm	13μm~40μm
Uniformity of copper surface thickness	R≤0.004mm	R≤0.002mm
Uniformity of copper thickness in holes	±0.005mm	±0.003mm
Through hole depth capability	10:1	10:1
Blind bore depth capability	0.8:1	1:1

Process parameters of the circuit

Project	Mass production process capability	Maximum range capability
Plate thickness range	0.3~6.0mm	0.3~6.0mm
Exposure alignment accuracy	±0.015mm	±0.005mm
Smallest hole ring	Single ≥ 0.05mm	Single ≥ 0.05mm
Minimum trace width/spacing for 1/3 OZ bottom copper	0.05mm/0.05mm	0.045mm/0.045mm
Minimum trace width/spacing for 1/2 OZ bottom copper	0.05mm/0.05mm	0.05mm/0.05mm
1. Minimum trace width/line spacing for OZ bottom copper	0.075mm/0.075mm	0.075mm/0.075mm
1/3 OZ bottom copper etching tolerance	±0.005mm	±0.005mm
1/2 OZ bottom copper etching tolerance	±0.005mm	±0.005mm
1 OZ bottom copper etching tolerance	±0.0075mm	±0.0075mm
Total Pitch Tolerance	30mm以下：±0.05mm 30~60mm：±0.075mm	30mm以下：±0.03mm 30~60mm：±0.05mm

Solder mask process parameters

Project	Mass production process capability	Maximum range capability
printing misalignment tolerance	±0.125mm	±0.1mm
Exposure offset tolerance	±0.05mm	±0.025mm
Minimal ink bridge	≥0.075mm	≥0.06mm
Ink thickness range	0.01mm~0.055mm	0.01mm~0.055mm
Ink thickness tolerance	±0.010mm	±0.005mm

Surface treatment process parameters

Project	Mass production process capability	Maximum range capability
Nickel Thickness (Electro-Nickel Gold)	1μm~20μm	1μm~20μm
Jinhou (Electro-nickel Gold)	0.05μm~0.25μm	0.05μm~0.25μm
Nickel Thickness (Nickel Alloy)	1μm~15μm	1μm~15μm
Jinhou (Nickel Alloy)	0.025μm~0.075μm	0.025μm~0.075μm
Film Thickness (OSP)	0.2μm~0.5μm	0.3μm~0.4μm

Text printing process parameters

Project	Mass production process capability	Maximum range capability
Offset tolerance	±0.075mm	±0.05mm
Minimum height for text	≥1.0mm	≥0.8mm
Minimum line width for text	≥0.10mm	≥0.075mm
Minimum distance from text to appearance	≥0.4mm	≥0.3mm
Minimum distance from text to line	≥0.4mm	≥0.3mm
Minimum distance from text to open window PAD	≥0.6mm	≥0.5mm

Molding process parameters

Project	Mass production process capability	Maximum range capability
External tolerance	±0.075mm	±0.05mm
The minimum distance from the line to the edge of the board	≥0.15mm	≥0.125mm
Open the window from the molded edge to the cover film	±0.15mm	±0.10mm
Semicircular hole with the smallest diameter	≥0.5mm	≥0.4mm
Minimum spacing between cells	≥1mm	≥1mm